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Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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Level 1 parts classi?

If jwdec higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers. The caution label shall be affixed to the MBB if used or to the lowest-level shipping container.

When this option is used, it must be veri? The following conditions apply regardless of the storage time i. C If blank, see adjacent bar code label 3. If the calculated shelf life is greater than 12 months, item 1 of the caution label should be changed accordingly.

If the actual shelf life has exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5.

Special consideration should be given to non-hermetic cavity packages. Calculated shelf life in sealed bag: With component and board temperature restrictions in mind, choose a bake temperature from Table ; then determine the appropriate bake duration based on the component to be removed.


J-std-0333b.1, and give reference conditions for drying SMD packages.

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Therefore, the effect of these materials must be compensated for by baking or, if required, adding additional desiccant in the MBB to ensure the shelf life of the J-str-033b.1 packages. The temperature and time for baking SMD packages are therefore limited by solderability considerations. This can be accomplished by dry pack according to Clause 3. It does not apply to j-std-033b.1 solder re? An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture weight gain to an acceptable level.

If bake is interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time. Cards with spots that do not indicate dry or wet conditions, per Tableshould be rejected. For components exposed anytime less than their stated? The period between drying and sealing must not exceed the MET less the time allowed for distributors j-stdd-033b.1 open the bags and repack parts.

Any SMD package that has not exceeded its? For the purpose of this standard, the bar code label is on the lowest level shipping container and includes information that describes the j-std033b.1 e.


Set the chamber for the next humidity and continue in this manner until data has been collected for all conditions. Other suggestions for document improvement: Peak package body temperature: Nominally, an acrylic box with a volume of approximately 2 cubic feet, having facilities for access to the box interior while maintaining atmosphere is used. For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table if packages have had extended exposure to factory ambient before bake.

A safe, yet conservative, handling approach is to expose the SMD packages only up to the maximum time limits for each moisture sensitivity level as shown in Table If one hour exposure is exceeded, refer to Clause 4.

We would like to thank them for their dedication to this effort. This will j-sdt-033b.1 the?

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Refer to Clause 6 for the baking of populated boards. Floor-life derating is discussed in Clause 7. Paper and Plastic Container Items